What are some more advanced references about factors that affect copper deposition?

I'm interested in what factors effect Cu deposition in very small areas such as sub-micron topography, crystal growth, adhesion, and leveling. Electrical conductivity is of prime concern. Any reference material would be appreciated, or addresses where I can continue my research.
-M David Marra

Richard C. Alkire, a chemical engineer at the University of Illinois at Urbana-Champaign, has published many innovative papers on factors affecting electrodeposition. His website contains the full text of a keynote lecture entitled Electrodeposition and Dissolution of Copper, along with a paper reference list and links to electrochemical resources and research groups on the Web.

Try these references from the Proceedings of the Electrochemical Society:

  • Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling, M. Paunovic, M. Datta, M. Matlosz, T. Osaka, and J.B. Talbot, Editors, Proc. Electrochem. Soc. 97-27, Paris, France - September 1997. ISBN 1-56677-180-3.
  • Fundamentals of Electrochemical Process Design: A Tutorial, J.B. Talbot and J.M. Fenton, editors, Proc. Electrochem. Soc., 95-11, Reno, Nevada - May 1995, ISBN 1-56677-105-6.

For more general information on electrochemistry, see the The Electrochemical Science and Technology Information Resource sponsored by Case Western Reserve University. The site has a list of Web resources, newsgroups, mailing lists, and FAQs for electrochemists, with bibliographies including chapter reviews, books, proceedings, journals, and institutions.

Author: Fred Senese senese@antoine.frostburg.edu


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